OL-PCA9411: WLCSP

Overview

wafer level chip-scale package; 9 bumps; 1.24 x 1.24 x 0.525 mm (backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-PCA9411	WLCSP	surface mount	bottom	UC	1.24 x 1.24 x 0.525	9	plastic

Manufacture Code	Reference Codes	Issue Date
OL-PCA9411		2015-09-29