OL-PCF2003DUS: WLCSP

Overview

wafer level chip-scale package; 8 bumps; 1.16 x 0.86 x 0.48 mm

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-PCF2003DUS	WLCSP	surface mount	bottom	UC	1.16 x 0.86 x 0.48	8	plastic

Manufacture Code	Reference Codes	Issue Date
OL-PCF2003DUS		2015-08-17