OL-PCF8576DU_DA: UC


Overview

Wire bond die; 59 bonding pads
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
UC surface mount upper UC 2.2 x 2 x 0.38 59 other
Manufacture Code Reference Codes Issue Date
UC59 ---(EIAJ);---(JEDEC);---(IEC) 2011-10-26