OL-PN548: WLCSP

Overview

wafer level chip-scale package; 42 bumps; 2.88 x 2.80 x 0.54 mm (backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-PN548	WLCSP	surface mount	bottom	UC	2.88 x 2.80 x 0.54	42	plastic

Manufacture Code	Reference Codes	Issue Date
OL-PN548		2015-08-06

Related Documents

Name/Description	Type	Modified Date
wlcsp42_pn548_fr  PDF	Supporting Information	2015-08-14