OL-PN548: WLCSP


Overview

wafer level chip-scale package; 42 bumps; 2.88 x 2.80 x 0.54 mm (backside coating included)
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP surface mount bottom UC 2.88 x 2.80 x 0.54 42 plastic
Manufacture Code Reference Codes Issue Date
OL-PN548 2015-08-06

Related Documents

Name/Description Type Modified Date
Supporting Information 2015-08-14