OL-SA58671UK: WLCSP

Overview

Wafer level chip-size package; 16 balls; 2.06 x 2.11 x 0.6 mm

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-SA58671UK	WLCSP	surface mount	bottom	UC	2.06 x 2.11 x 0.6	16	other

Manufacture Code	Reference Codes	Issue Date
WLCSP16		2007-10-17