OL-TDA1308AUK: WLCSP


Overview

Wafer level chip-size package; 8 bumps; 0.61 x 0.84 x 0.38 mm
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP surface mount bottom UC 0.61 x 0.84 x 0.38 8 other
Manufacture Code Reference Codes Issue Date
WLCSP8 2006-12-15