OL-TDA1308AUK: WLCSP

Overview

Wafer level chip-size package; 8 bumps; 0.61 x 0.84 x 0.38 mm

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-TDA1308AUK	WLCSP	surface mount	bottom	UC	0.61 x 0.84 x 0.38	8	other

Manufacture Code	Reference Codes	Issue Date
WLCSP8		2006-12-15