OL-TFA9860: WLCSP


Overview

wafer level chip-size package; 49 bumps; 3.37 x 2.97 mm
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP surface mount bottom UC 3.37 x 2.97 x 0.6 49 other
Manufacture Code Reference Codes Issue Date
WLCSP49 ---(EIAJ);---(JEDEC);---(IEC) 2013-03-07