OL-TFA9860: WLCSP

Overview

wafer level chip-size package; 49 bumps; 3.37 x 2.97 mm

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-TFA9860	WLCSP	surface mount	bottom	UC	3.37 x 2.97 x 0.6	49	other

Manufacture Code	Reference Codes	Issue Date
WLCSP49	---(EIAJ);---(JEDEC);---(IEC	2013-03-07