SOT1035-1: HBGA736

Overview

plastic thermal enhanced ball grid array package; 736 balls; heatsink

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1035-1	HBGA736	surface mount	bottom	HBGA	35 x 35 x 1.8	736	plastic

Manufacture Code	Reference Codes	Issue Date
SOT1035		2009-08-14