SOT1088-1: HBGA520

Overview

plastic thermal enhanced ball grid array package; 520 balls; heatsink

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1088-1	HBGA520	surface mount	bottom	HBGA		520	plastic

Manufacture Code	Reference Codes	Issue Date
SOT1088	MS-034(JEDEC);144E(IEC	2008-06-03