SOT1088-1: HBGA520


Overview

plastic thermal enhanced ball grid array package; 520 balls; heatsink
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
HBGA520 surface mount bottom HBGA 520 plastic
Manufacture Code Reference Codes Issue Date
SOT1088 MS-034(JEDEC);144E(IEC) 2008-06-03