SOT1095-1: HBGA624

Overview

plastic thermal enhanced ball grid array package; 624 balls; heatsink, 1 mm pitch, 35 mm x 35 mm x1.75 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1095-1	HBGA624	surface mount	bottom	HBGA	35 x 35 x 1.75	624	plastic

Manufacture Code	Reference Codes	Issue Date
SOT1095-1		2008-11-17