SOT1095-1: HBGA624


Overview

plastic thermal enhanced ball grid array package; 624 balls; heatsink
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
HBGA624 surface mount bottom HBGA 624 plastic
Manufacture Code Reference Codes Issue Date
SOT1095 - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2008-11-17