SOT1119-1: HBGA432


Overview

plastic thermal enhanced ball grid array package; 432 balls; heatsink
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
HBGA432 surface mount bottom HBGA 35 x 35 x 1.75 432 plastic
Manufacture Code Reference Codes Issue Date
SOT1119 ---(EIAJ);MS-034(JEDEC);144E(IEC) 2009-08-14
Part Description Quick access
Video Post Processor