SOT1123-2: HBGA324


Overview

plastic thermal enhanced ball grid array package; 324 balls; heatsink
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
HBGA324 surface mount bottom HBGA 23 x 23 x 1.73 324 plastic
Manufacture Code Reference Codes Issue Date
SOT1123 - - -(EIAJ);MS-034(JEDEC);144E(IEC) 2010-01-06