SOT1142-1: HBGA543


Overview

plastic thermal enhanced ball grid array package; 543 balls; heatsink
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
HBGA543 surface mount bottom HBGA 27 x 27 x 1.73 543 plastic
Manufacture Code Reference Codes Issue Date
SOT1142 - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2009-08-03