SOT1142-1: HBGA543

Overview

plastic thermal enhanced ball grid array package; 543 balls; heatsink, 1 mm pitch, 27 mm x 27 mm x 1.73 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1142-1	HBGA543	surface mount	bottom	HBGA	27 x 27 x 1.73	543	plastic

Manufacture Code	Reference Codes	Issue Date
SOT1142		2009-08-03