SOT1151-1: HBGA640


Overview

plastic thermal enhanced ball grid array package; 640 balls; heatsink
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
HBGA640 surface mount bottom HBGA 27 x 27 x 2.4 640 plastic
Manufacture Code Reference Codes Issue Date
SOT1151 MS-034D compliant(JEDEC) 2009-10-19