SOT1163-1: HBGA360


Overview

plastic, thermal enhanced ball grid array package; 360 balls; heatsink
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
HBGA360 surface mount bottom HBGA 23 x 23 x 1.75 360 plastic
Manufacture Code Reference Codes Issue Date
SOT1163 - - -(EIAJ);MS-034(JEDEC);144E(IEC) 2010-01-22