SOT1376-2: WLCSP4


Overview

WLCSP4, wafer level chip-scale package; 4 bumps; 0.97 mm x 0.97 mm x 0.54 mm body (backside coating included)
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP4 surface mount bottom WLCSP 4
Manufacture Code Reference Codes Issue Date
SOT1376-2 2017-08-22
Part Description Quick access