SOT1376-2: WLCSP4

Overview

WLCSP4, wafer level chip-scale package; 4 bumps; 0.97 mm x 0.97 mm x 0.54 mm body (backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1376-2	WLCSP4	surface mount	bottom	WLCSP		4

Manufacture Code	Reference Codes	Issue Date
SOT1376-2		2017-08-22

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