SOT1384-4: WLCSP9


Overview

WLCSP9, wafer level chip-scale package; 9 bumps; 1.50 mm x 1.28 mm x 0.60 mm body
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP9 surface mount bottom WLCSP 1.50 x 1.28 x 0.60 other
Manufacture Code Reference Codes Issue Date
SOT1384-4 2017-03-03
Part Description Quick access