SOT1384-4: WLCSP9

Overview

WLCSP9, wafer level chip-scale package; 9 bumps; 1.50 mm x 1.28 mm x 0.60 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1384-4	WLCSP9	surface mount	bottom	WLCSP	1.50 x 1.28 x 0.60		other

Manufacture Code	Reference Codes	Issue Date
SOT1384-4		2017-03-03