SOT1390-1: WLCSP12

Overview

WLCSP12, wafer level chip scale package; 12 bumps; 0.4 mm pitch; 1.36 mm x 1.66 mm x 0.51 mm body (backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1390-1	WLCSP12	surface mount	bottom	WLCSP	1.36 x 1.66 x 0.31	12

Manufacture Code	Reference Codes	Issue Date
SOT1390-1		2017-09-09