SOT1390-1: WLCSP12


Overview

WLCSP12, wafer level chip scale package; 12 bumps; 0.4 mm pitch; 1.36 mm x 1.66 mm x 0.51 mm body (backside coating included)
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP12 surface mount bottom WLCSP 1.36 x 1.66 x 0.31 12
Manufacture Code Reference Codes Issue Date
SOT1390-1 2017-09-09