SOT1390-5: WLCSP12


Overview

wafer level chip-scale package, 12 bumps
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP12 surface mount bottom WLCSP 1.65 x 1.35 x 0.525 12
Manufacture Code Reference Codes Issue Date
SOT1390 2016-03-02
Part Description Quick access