SOT1390-6: WLCSP12

Overview

WLCSP12, wafer level chip-scale package; 12 bumps; 1.62 mm x 1.43 mm x 0.525 mm (backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1390-6	WLCSP12	surface mount	bottom	WLCSP	1.62 x 1.43 x 0.525	12

Manufacture Code	Reference Codes	Issue Date
SOT1390		2017-01-11