SOT1390-7: WLCSP12

Overview

WLCSP12, wafer level chip-scale package; 12 bumps; 1.67 mm x 1.27 mm x 0.525 mm (backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1390-7	WLCSP12	surface mount	bottom	WLCSP	1.67 x 1.27 x 0.525	12

Manufacture Code	Reference Codes	Issue Date
SOT1390		2017-04-24

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