SOT1390-7: WLCSP12


Overview

WLCSP12, wafer level chip-scale package; 12 bumps; 1.67 mm x 1.27 mm x 0.525 mm (backside coating included)
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP12 surface mount bottom WLCSP 1.67 x 1.27 x 0.525 12
Manufacture Code Reference Codes Issue Date
SOT1390 2017-04-24
Part Description Quick access