SOT1390-8: WLCSP12


Overview

WLCSP12, wafer level chip scale package; 12 bumps; 0.4 mm pitch; 1.65 mm x 1.25 mm x 0.525 mm body (backside coating included)
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP12 surface mount bottom WLCSP 4 x 4 x 0.5 12
Manufacture Code Reference Codes Issue Date
SOT1390-8 2017-10-23
Part Description Quick access