SOT1392-1: WLCSP


Overview

wafer level chip-scale package; 15 bumps; 2.56 x 1.54 x 0.555 mm (Backside coating included)
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP surface mount bottom UC 2.56 x 1.54 x 0.555 15 plastic
Manufacture Code Reference Codes Issue Date
SOT1392 2015-08-11
Part Description Quick access