SOT1392-1: WLCSP

Overview

wafer level chip-scale package; 15 bumps; 2.56 x 1.54 x 0.555 mm (Backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1392-1	WLCSP	surface mount	bottom	UC	2.56 x 1.54 x 0.555	15	plastic

Manufacture Code	Reference Codes	Issue Date
SOT1392		2015-08-11

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