SOT1393-2: WLCSP16

Overview

WLCSP16, wafer level chip-scale package; 16 bumps; 1.84 mm x 1.84 mm x 0.5 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1393-2	WLCSP16	surface mount	bottom	WLCSP	1.84 x 1.84 x 0.5	16

Manufacture Code	Reference Codes	Issue Date
98ASA01190D		2018-02-09

Products

Part	Description	Quick access
LPC802UK	Low-Cost Microcontrollers (MCUs) based on Arm® Cortex®M0+ Cores	View parametrics