SOT1394-2: WLCSP16


Overview

wafer level chip-scale package; 16 bumps; 2.05 x 2.05 x 0.555 mm (Backside coating included)
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP16 surface mount bottom WLCSP 2.05 x 2.05 x 0.555 16 other
Manufacture Code Reference Codes Issue Date
SOT1394 2016-08-29
Part Description Quick access