SOT1394-3: WLCSP16


Overview

WLCSP16, wafer level chip-scale package, 16 bumps, 2.20 mm x 2.20 mm x 0.555 mm body (backside coating included)
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP16 surface mount bottom WLCSP 2.20 x 2.20 x 0.555 16
Manufacture Code Reference Codes Issue Date
SOT1394 2018-03-12
Part Description Quick access