SOT1397-4: WLCSP20

Overview

wafer level chip-scale package, 20 bumps

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1397-4	WLCSP20	surface mount	bottom	WLCSP	2.04 x 1.64 x 0.45	20

Manufacture Code	Reference Codes	Issue Date
SOT1397		2016-04-26