SOT1397-6: WLCSP20


WLCSP20, wafer level chip-scale package; 20 bumps; 1.70 mm x 2.16 mm x 0.525 mm body (backside coating included)
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP20 surface mount bottom WLCSP 1.70 x 2.16 x 0.525 20
Manufacture Code Reference Codes Issue Date
SOT1397 2017-01-19
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