SOT1397-7: WLCSP25

Overview

WLCSP25, wafer level chip-scale package; 25 bumps; 0.4 mm pitch, 2.09 mm x 2.09 mm x 0.525 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1397-7	WLCSP25	surface mount	bottom	WLCSP	2.09 x 2.09 x 0.525	25

Manufacture Code	Reference Codes	Issue Date
98ASA01151D		2017-12-04