SOT1397-8: WLCSP20

Overview

WLCSP20, wafer level chip-scale package; 20 bumps; 0.4 mm pitch, 2.50 mm x 1.84 mm x 0.5 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1397-8	WLCSP20	surface mount	bottom	WLCSP	2.50 x 1.84 x 0.5	20

Manufacture Code	Reference Codes	Issue Date
98ASA01253D		2018-05-24

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