SOT1397-8: WLCSP20


Overview

WLCSP20, wafer level chip-scale package; 20 bumps; 0.4 mm pitch, 2.50 mm x 1.84 mm x 0.5 mm body
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP20 surface mount bottom WLCSP 2.50 x 1.84 x 0.5 20
Manufacture Code Reference Codes Issue Date
98ASA01253D 2018-05-24