SOT1399-1: WLCSP24

Overview

WLCSP24, wafer level chip-scale package; 24 bumps; 2.98 mm x 1.90 mm x 0.525 mm body (backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1399-1	WLCSP24	surface mount	bottom	WLCSP	2.98 x 1.90 x 0.525	24

Manufacture Code	Reference Codes	Issue Date
SOT1399		2017-06-22