SOT1443-2: WLCSP


Overview

wafer level chip-scale package; 30 bumps; 2.26 x 2.56 x 0.51 mm (backside coating included)
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP surface mount bottom UC 2.26 x 2.56 x 0.51 30 plastic
Manufacture Code Reference Codes Issue Date
SOT1443 2015-06-11
Part Description Quick access