SOT1443-3: WLCSP

Overview

wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.525 mm (Backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1443-3	WLCSP	surface mount	bottom	WLCSP	2.06 x 2.72 x 0.525	30

Manufacture Code	Reference Codes	Issue Date
SOT1443		2016-04-26