SOT1443-3: WLCSP


Overview

wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.525 mm (Backside coating included)
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP surface mount bottom WLCSP 2.06 x 2.72 x 0.525 30
Manufacture Code Reference Codes Issue Date
SOT1443 2016-04-26
Part Description Quick access