SOT1444-10: WLCSP

Overview

WLCSP49, wafer level chip-scale package; 49 bumps; 2.97 mm x 3.37 mm x 0.56 mm (backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1444-10	WLCSP	surface mount	bottom	WLCSP	2.97 x 3.37 x 0.56	49

Manufacture Code	Reference Codes	Issue Date
SOT1444		2017-01-06