SOT1444-5: WLCSP49

Overview

WLCSP49, wafer level chip-scale package; 49 bumps; 3.44 mm x 3.44 mm x 0.525 mm (Backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1444-5	WLCSP49	surface mount	bottom	WLCSP	3.44 x 3.44 x 0.525	49

Manufacture Code	Reference Codes	Issue Date
SOT1444-5		2016-04-26