SOT1444-6: WLCSP

Overview

wafer level chip-scale package; 49 bumps; 2.97 x 3.37 x 0.5 mm

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1444-6	WLCSP	surface mount	bottom	WLCSP	2.97 x 3.37 x 0.5	49

Manufacture Code	Reference Codes	Issue Date
SOT1444		2016-04-26