SOT1444-6: WLCSP


Overview

wafer level chip-scale package; 49 bumps; 2.97 x 3.37 x 0.5 mm
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP surface mount bottom WLCSP 2.97 x 3.37 x 0.5 49
Manufacture Code Reference Codes Issue Date
SOT1444 2016-04-26