SOT1444-9: WLCSP

Overview

wafer level chip-scale package; 49 bumps; 3.19 mm x 3.19 mm x 0.49 mm

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1444-9	WLCSP	surface mount	bottom	WLCSP	3.19 x 3.19 x 0.49	49

Manufacture Code	Reference Codes	Issue Date
SOT1444		2016-04-26