SOT1447-1: WLCSP99

Overview

wafer level chip-scale package; 99 bumps; 4.37 x 3.82 x 0.5 mm

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1447-1	WLCSP99	surface mount	bottom	WLCSP	4.37 x 3.82 x 0.5	99

Manufacture Code	Reference Codes	Issue Date
SOT1447		2015-06-26