SOT1447-2: WLCSP

Overview

wafer level chip-scale package; 99 bumps; 4.37 x 3.82 x 0.525 mm (Backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1447-2	WLCSP	surface mount	bottom	UC	4.37 x 3.82 x 0.525	99	other

Manufacture Code	Reference Codes	Issue Date
SOT1447		2015-10-09