SOT1452-1: WLCSP11

Overview

wafer level chip-scale package, 11 bumps

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1452-1	WLCSP11	surface mount	bottom	WLCSP	0.87 x 0.67 x 0.305	11

Manufacture Code	Reference Codes	Issue Date
SOT1452		2016-03-02