SOT1453-1: WLCSP8

Overview

wafer level chip-scale package, 8 bumps

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1453-1	WLCSP8	surface mount	bottom	WLCSP	0.65 x 0.65 x 0.305	8

Manufacture Code	Reference Codes	Issue Date
SOT1453		2016-03-02