SOT1459-2: WLCSP

Overview

wafer level chip-scale package; 42 bumps; 3.13 x 2.46 x 0.5 mm (backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1459-2	WLCSP	surface mount	bottom	WLCSP	3.13 x 2.46 x 0.50	42

Manufacture Code	Reference Codes	Issue Date
SOT1459		2016-04-26

Products

Part	Description	Quick access
TFA9872AUK		View parametrics