SOT1459-6: WLCSP


Overview

WLCSP42, wafer level chip-scale package; 42 bumps; 2.91 mm x 2.51 mm x 0.525 mm body (backside coating included)
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP surface mount bottom WLCSP 2.91 x 2.51 x 0.525 42
Manufacture Code Reference Codes Issue Date
SOT1459-6 2017-07-28
Part Description Quick access