SOT1459-6: WLCSP

Overview

WLCSP42, wafer level chip-scale package; 42 bumps; 2.91 mm x 2.51 mm x 0.525 mm body (backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1459-6	WLCSP	surface mount	bottom	WLCSP	2.91 x 2.51 x 0.525	42

Manufacture Code	Reference Codes	Issue Date
SOT1459-6		2017-07-28

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