SOT1461-1: WLCSP

Overview

WLCSP13, wafer level chip-size package; 13 bumps, 0.4 mm pitch, 2.74 mm x 2.80 mm x 0.38 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1461-1	WLCSP	surface mount	bottom	WLCSP	2.74 x 2.80 x 0.38	13	other

Manufacture Code	Reference Codes	Issue Date
SOT1461		2016-08-08

Products

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NXH5104UK	4 Mbit Serial EEPROM	View parametrics