SOT1461-2: WLCSP

Overview

WLCSP13, wafer level chip-scale package; 13 bumps; 1.19 mm x 1.99 mm x 0.5 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1461-2	WLCSP	surface mount	bottom	WLCSP	1.19 x 1.99 x 0.5	13	other

Manufacture Code	Reference Codes	Issue Date
SOT1461		2017-02-23