SOT1464-1: WLCSP6

Overview

WLCSP6, wafer level chip-scale package, 6 bumps, 0.19 mm pitch, 0.57 mm x 0.43 mm x 0.28 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1464-1	WLCSP6	surface mount	bottom	WLCSP	0.57 x 0.43 x 0.28	6

Manufacture Code	Reference Codes	Issue Date
SOT1464		2016-04-25