SOT1744-1: HBGA668


Overview

HBGA668, plastic, thermal enhanced ball grid array; 668 balls; 1 mm pitch; 29 mm x 29 mm x 1.8 mm body
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
HBGA668 surface mount bottom HBGA 29 x 29 x 1.8 668 plastic
Manufacture Code Reference Codes Issue Date
98ASA10735D HT-PBGA-B668(JEDEC 2017-06-11
Part Description Quick access
PowerQUICC, 32 Bit Power Arch SoC, 400MHz, DDR1/2, PCI, 1GbE, USB, TDM, ATM, -40 to 105C, Rev 1
PowerQUICC, 32 Bit Power Arch SoC, 266MHz, DDR1/2, PCI, 1GbE, USB, TDM, ATM, 0 to 105C, Rev 1
PowerQUICC, 32 Bit Power Arch SoC, 400MHz, DDR1/2, PCI, 1GbE, USB, TDM, ATM, 0 to 105C, Rev 1
PowerQUICC, 32 Bit Power Arch SoC, 400MHz, DDR1/2, PCI, 1GbE, USB, TDM, ATM, SEC, 0 to 105C, Rev 1
PowerQUICC, 32 Bit Power Arch SoC, 266MHz, DDR1/2, PCI, 1GbE, USB, TDM, ATM, -40 to 105C, Rev 1
PowerQUICC, 32 Bit Power Arch SoC, 400MHz, DDR1/2, PCI, 1GbE, USB, TDM, ATM, SEC, 0 to 105C, Rev 1
PowerQUICC, 32 Bit Power Arch SoC, 400MHz, DDR1/2, PCI, 1GbE, USB, TDM, ATM, 0 to 105C, Rev 1
PowerQUICC, 32 Bit Power Arch SoC, 400MHz, DDR1/2, PCI, 1GbE, USB, TDM, ATM, SEC, -40 to 105C, Rev 1
PowerQUICC, 32 Bit Power Arch SoC, 400MHz, DDR1/2, PCI, 1GbE, USB, TDM, ATM, -40 to 105C, Rev 1
PowerQUICC, 32 Bit Power Arch SoC, 400MHz, DDR1/2, PCI, 1GbE, USB, TDM, ATM, SEC, -40 to 105C, Rev 1