SOT1762-2: SSOP32


Overview

SSOP32; plastic, shrink small outline package; 32 terminals; 0.65 mm pitch; 11 mm x 7.5 mm x 2.3 mm body
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
SSOP32 surface mount double SSOP 7.5 x 11 x 2.3 32 plastic
Manufacture Code Reference Codes Issue Date
98ASA00259D 2016-01-07
Part Description Quick access
System Basis Chip, 2 LIN, 2x 3.3 V/400mA LDOs, up to 3 wakeup, SOIC 32
System Basis Chip, 2 LIN, 2x 5.0 V/400mA LDOs, up to 3 wakeup, SOIC 32
Switch Detection Interface, 22-switches with Suppressed Wakeup, 3.3 V / 5.0 V SPI , SOIC 32
System Basis Chip, 2x 3.3 V/400mA LDOs, 3 wakeup, SOIC 32
Switch Detection Interface, 22-switches with Suppressed Wakeup, 3.3 V / 5.0 V SPI , SOIC 32
System Basis Chip, 2x 5.0 V/400mA LDOs, 3 wakeup, SOIC 32
Switch Detection Interface, 22-switches, 32mA Suppressed Wakeup, 3.3 V / 5.0 V SPI , SOIC 32
SBC W/HIGH SPEED CAN 3.3V
System Basis Chip, LIN, 2x 3.3 V/400mA LDOs, 2/3 wakeup, SOIC 32
System Basis Chip, LIN, 2x 3.3 V/400mA LDOs, 2/3 wakeup, SOIC 32
System Basis Chip,LIN, 2x 5.0 V/400mA LDOs, 2/3 wakeup, SOIC 32
Switch Detection Interface, 22-switches, 32mA Suppressed Wakeup, 3.3 V / 5.0 V SPI , SOIC 32
System Basis Chip,LIN, 2x 5.0 V/400mA LDOs, 2/3 wakeup, SOIC 32
Switch Detection Interface, 22-switches, 32mA Suppressed Wakeup, 3.3 V / 5.0 V SPI , SOIC 32
SBC W/HIGH SPEED CAN 5V
System Basis Chip, LIN, 2x 3.3 V/400mA LDOs, 2/3 wakeup, SOIC 32
System Basis Chip,LIN, 2x 5.0 V/400mA LDOs, 2/3 wakeup, SOIC 32
System Basis Chip, 2 LIN, 2x 5.0 V/400mA LDOs, up to 3 wakeup, SOIC 32
System Basis Chip, 2x 5.0 V/400mA LDOs, 3 wakeup, SOIC 32
System Basis Chip, 2 LIN, 2x 3.3 V/400mA LDOs, up to 3 wakeup, SOIC 32
System Basis Chip, 2x 3.3 V/400mA LDOs, 3 wakeup, SOIC 32
SBC W/HIGH SPEED CAN 5V
System Basis Chip, 2x 5.0 V/400mA LDOs, 3 wakeup, SOIC 32
SBC W/HIGH SPEED CAN 3.3V
System Basis Chip, 2x 3.3 V/400mA LDOs, 3 wakeup, SOIC 32