SOT1774-1: WLCSP120

Overview

WLCSP120, wafer level chip-size package; 120 terminals; 0.4 mm pitch; 5.28 mm x 5.29 mm x 0.6 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1774-1	WLCSP120	surface mount	bottom	WLCSP	5.28 x 5.29 x 0.6	120

Manufacture Code	Reference Codes	Issue Date
98ASA00311D	NON-JEDEC(JEDEC	2017-06-11