SOT1780-6: WLCSP36


Overview

WLCSP36, wafer level chip-scale package; 36 bumps; 0.4 mm pitch, 2.62 mm x 2.51 mm x 0.5 mm body
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP36 surface mount bottom WLCSP 2.62 x 2.51 x 0.5 36
Manufacture Code Reference Codes Issue Date
SOT1780-6 2017-09-18
Part Description Quick access